POWER CONTROL AND OPTIMIZATION: Proceedings of the 7th Global Conference on Power Control and Optimization
978-983-44483-63
The Impact of Wick Structure in LHP to Remove Waste Heat from Electronic Component
Martin Smitka, Patrik Nemec, Milan Malcho
PCO Conf-Proc 2008 (2013), - PDF
Abstract. Loop heat pipes (LHP) are used in many branches of industry, mainly for cooling of electrical elements and systems. The loop heat pipe is a vapour-liquid phase-change device that transfers heat from evaporator to condenser. One of the most important parts of the LHP is the porous wick structure. The wick structure provides capillary force to circulate the working fluid. To achieve good thermal performance of LHP, capillary wicks with high permeability and porosity and fine pore radius are expected. The aim of this work is to develop porous wick of sintered copper powder with different grain sizes. There were grain sizes with 50 and 100 μm. Then this porous wicks were used in LHP and there were performed a series of measurements impact of wick to remove waste heat from the insulated gate bipolar transistor (IGBT).
© 2013 PCO based on American Institute of Physics